Browsing Technical Reports and Working Papers by Subject "3D integration, cost modeling, heuristic optimization"

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  • Agrawal, Mukesh; Chakrabarty, Krishnendu; Eklow, Bill (2012-10-26)
    Three-dimensional (3D) integration is an attractive technology platform for next-generation ICs. Despite the benefits offered by 3D integration, test cost remains a major concern, and analysis and tools are needed to ...