DukeSpace

Technical Reports

DukeSpace

Technical Reports

 

Collections

Recent Submissions

  • Agrawal, Mukesh; Chakrabarty, Krishnendu; Eklow, Bill (2012-10-26)
    Three-dimensional (3D) integration is an attractive technology platform for next-generation ICs. Despite the benefits offered by 3D integration, test cost remains a major concern, and analysis and tools are needed to ...
  • Luo, Yan; Chakrabarty, Krishnendu; Ho, Tsung-Yi (2012-07-20)
    Droplet-based “digital” microfluidics technology has now come of age and software-controlled biochips for healthcare applications are starting to emerge. However, today’s digital microfluidic biochips suffer from the ...
  • Duan, Qing; Agrawal, Mukesh; Chakrabarty, Krishnendu; Zeng, Jun; Dispoto, Gary (2012-03-30)
    On-demand digital-print service offers mass customization and exemplifies personalized manufacturing services. We describe a real-time and online optimization technique based on genetic algorithms (GA) for print factory ...
  • Kavousianos, Xrysovalantis; Chakrabarty, Krishnendu; Arvind Jain, Rubin Parekhji (2012-03-28)
    Dynamic voltage scaling (DVS) has been widely adopted in multicore SoCs for reducing dynamic power consumption. Despite its benefits, the use of DVS increases test time because high product quality can only be ensured ...
  • Fang, Hongxia; Chakrabarty, Krishnendu; Jas, Abhijit; Tirumurti, Chandra (2011-07-12)
    Functional test sequences are often used in manufacturing testing to target defects that are not detected by structural test. Therefore, it is necessary to evaluate the quality of functional test sequences. However, it ...