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    • Test-Cost Modeling and Optimal Test-Flow Selection of 3D-Stacked ICs 

      Agrawal, Mukesh; Chakrabarty, Krishnendu (2015-03-02)
      Three-dimensional (3D) integration is an attractive technology platform for next-generation ICs. Despite the benefits offered by 3D integration, test cost remains a major concern, and analysis and tools are needed to understand ...