Browsing by Subject "3D integration, cost modeling, heuristic optimization"

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    • Test-Cost Optimization and Test-Flow Selection for 3D-Stacked ICs 

      Agrawal, M; Chakrabarty, K (2012-10-26)
      Three-dimensional (3D) integration is an attractive technology platform for next-generation ICs. Despite the benefits offered by 3D integration, test cost remains a major concern, and analysis and tools are needed to understand ...