Silica polymer bonding of stressed silica grains: An early growth of intergranular tensile strength
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© 2015 Elsevier Ltd. All rights reserved.Laboratory tests on microscale are reported in which millimeter-sized amorphous silica cubes were kept highly compressed in a liquid environment of de-ionized water solutions with different silica ion concentrations for up to four weeks. Such an arrangement simulates an early evolution of bonds between two sand grains stressed in situ. In-house designed Grain Indenter-Puller apparatus allowed measuring strength of such contacts after 3-4 weeks. Observations reported for the first time confirm a long-existing hypothesis that a stressed contact with microcracks generates silica polymers, forming a bonding structure between the grains on a timescale in the order of a few weeks. Such structure exhibits intergranular tensile force at failure of 1-1.5 mN when aged in solutions containing silica ion concentrations of 200-to 500-ppm. The magnitude of such intergranular force is 2-3 times greater than that of water capillary force between the same grains.
Published Version (Please cite this version)10.1016/j.gete.2015.02.002
Publication InfoGuo, R; & Hueckel, T (2015). Silica polymer bonding of stressed silica grains: An early growth of intergranular tensile strength. Geomechanics for Energy and the Environment, 1. pp. 48-59. 10.1016/j.gete.2015.02.002. Retrieved from https://hdl.handle.net/10161/10760.
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Professor of Civil and Environmental Engineering
Tomasz Hueckel received his master's degree in civil engineering from the University of Technology in Gdansk, Poland, in 1968, his Ph.D. in applied mechanics from the Polish Academy of Sciences in Warsaw, in 1974, and the D.Sc. in physical sciences from the University of Grenoble, France, in 1985. He started his research career at the Polish Academy of Sciences in Warsaw, then taught at the University of Rome and the University of Technology in Milan before joining ISMES, a research institute