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A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods.

dc.contributor.author Wei, Qingyi
dc.contributor.author Dai, Wen
dc.contributor.author Lv, Le
dc.contributor.author Lu, Jibao
dc.contributor.author Hou, Hao
dc.contributor.author Yan, Qingwei
dc.contributor.author Alam, Fakhr E
dc.contributor.author Li, Yifan
dc.contributor.author Zeng, Xiaoliang
dc.contributor.author Yu, Jinhong
dc.contributor.author Xu, Xiangfan
dc.contributor.author Wu, Jianbo
dc.contributor.author Jiang, Nan
dc.contributor.author Du, Shiyu
dc.contributor.author Sun, Rong
dc.contributor.author Xu, Jianbin
dc.contributor.author Wong, Ching-Ping
dc.contributor.author Lin, Cheng-Te
dc.date.accessioned 2019-05-01T18:13:04Z
dc.date.available 2019-05-01T18:13:04Z
dc.date.issued 2019-02-13
dc.identifier.issn 1936-0851
dc.identifier.issn 1936-086X
dc.identifier.uri https://hdl.handle.net/10161/18495
dc.description.abstract With the increasing integration of devices in electronics fabrication, there are growing demands for thermal interface materials (TIMs) with high through-plane thermal conductivity for efficiently solving thermal management issues. Graphene-based papers consisting of a layer-by-layer stacked architecture have been commercially used as lateral heat spreaders; however, they lack in-depth studies on their TIM applications due to the low through-plane thermal conductivity (<6 W m-1 K-1). In this study, a graphene hybrid paper (GHP) was fabricated by the intercalation of silicon source and the in situ growth of SiC nanorods between graphene sheets based on the carbothermal reduction reaction. Due to the formation of covalent C-Si bonding at the graphene-SiC interface, the GHP possesses a superior through-plane thermal conductivity of 10.9 W m-1 K-1 and can be up to 17.6 W m-1 K-1 under packaging conditions at 75 psi. Compared with the current graphene-based papers, our GHP has the highest through-plane thermal conductivity value. In the TIM performance test, the cooling efficiency of the GHP achieves significant improvement compared to that of state-of-the-art thermal pads. Our GHP with characteristic structure is of great promise as an inorganic TIM for the highly efficient removal of heat from electronic devices.
dc.language eng
dc.publisher American Chemical Society (ACS)
dc.relation.ispartof ACS nano
dc.relation.isversionof 10.1021/acsnano.8b07337
dc.subject graphene hybrid paper
dc.subject hierarchical structure
dc.subject silicon carbide nanorods
dc.subject thermal interface materials
dc.subject through-plane thermal conductivity
dc.title A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods.
dc.type Journal article
dc.date.updated 2019-05-01T18:13:03Z
pubs.begin-page 1547
pubs.end-page 1554
pubs.issue 2
pubs.organisational-group School of Medicine
pubs.organisational-group Duke
pubs.organisational-group Duke Cancer Institute
pubs.organisational-group Institutes and Centers
pubs.organisational-group Population Health Sciences
pubs.organisational-group Basic Science Departments
pubs.organisational-group Medicine, Medical Oncology
pubs.organisational-group Medicine
pubs.organisational-group Clinical Science Departments
pubs.publication-status Published
pubs.volume 13
duke.contributor.orcid Wei, Qingyi|0000-0002-3845-9445


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