Arbitrary Acoustics Hologram Based on Structured OAM Beams

dc.contributor.advisor

Huang, Tony Jun

dc.contributor.author

Yu, Wenjun

dc.date.accessioned

2023-06-08T18:35:00Z

dc.date.issued

2023

dc.department

Mechanical Engineering and Materials Science

dc.description.abstract

In this study, we present a novel on-chip 2D hologram device of an on-chip hologram device capable of generating both arbitrary 3D nodes and 2D microscale nodes. As the first true 3D hologram folded on chip, our approach combines a refined fabrication process with a novel theoretical framework, which employs Fresnel transformation to describe the patterns, enabling the shaping of patterns in 3D, thus broadening the potential applications of lab-on-chip devices and establishing a new generation of acoustic tweezers. We also reduced the complexity of setup and manufacturing thus achieving high resolution and low tolerance with lithographic techniques. Our work holds promise for a wide range of applications, including biomedical, material handling, and sensing technologies, marking a noteworthy advancement in the pursuit of efficient and precise acoustic manipulation.

dc.identifier.uri

https://hdl.handle.net/10161/27890

dc.subject

Mechanical engineering

dc.title

Arbitrary Acoustics Hologram Based on Structured OAM Beams

dc.type

Master's thesis

duke.embargo.months

24

duke.embargo.release

2025-05-25T00:00:00Z

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