A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods.

dc.contributor.author

Dai, Wen

dc.contributor.author

Lv, Le

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Lu, Jibao

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Hou, Hao

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Yan, Qingwei

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Alam, Fakhr E

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Li, Yifan

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Zeng, Xiaoliang

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Yu, Jinhong

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Wei, Qiuping

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Xu, Xiangfan

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Wu, Jianbo

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Jiang, Nan

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Du, Shiyu

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Sun, Rong

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Xu, Jianbin

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Wong, Ching-Ping

dc.contributor.author

Lin, Cheng-Te

dc.date.accessioned

2019-05-01T18:13:04Z

dc.date.available

2019-05-01T18:13:04Z

dc.date.issued

2019-02-13

dc.date.updated

2019-05-01T18:13:03Z

dc.description.abstract

With the increasing integration of devices in electronics fabrication, there are growing demands for thermal interface materials (TIMs) with high through-plane thermal conductivity for efficiently solving thermal management issues. Graphene-based papers consisting of a layer-by-layer stacked architecture have been commercially used as lateral heat spreaders; however, they lack in-depth studies on their TIM applications due to the low through-plane thermal conductivity (<6 W m-1 K-1). In this study, a graphene hybrid paper (GHP) was fabricated by the intercalation of silicon source and the in situ growth of SiC nanorods between graphene sheets based on the carbothermal reduction reaction. Due to the formation of covalent C-Si bonding at the graphene-SiC interface, the GHP possesses a superior through-plane thermal conductivity of 10.9 W m-1 K-1 and can be up to 17.6 W m-1 K-1 under packaging conditions at 75 psi. Compared with the current graphene-based papers, our GHP has the highest through-plane thermal conductivity value. In the TIM performance test, the cooling efficiency of the GHP achieves significant improvement compared to that of state-of-the-art thermal pads. Our GHP with characteristic structure is of great promise as an inorganic TIM for the highly efficient removal of heat from electronic devices.

dc.identifier.issn

1936-0851

dc.identifier.issn

1936-086X

dc.identifier.uri

https://hdl.handle.net/10161/18495

dc.language

eng

dc.publisher

American Chemical Society (ACS)

dc.relation.ispartof

ACS nano

dc.relation.isversionof

10.1021/acsnano.8b07337

dc.subject

graphene hybrid paper

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hierarchical structure

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silicon carbide nanorods

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thermal interface materials

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through-plane thermal conductivity

dc.title

A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods.

dc.type

Journal article

duke.contributor.orcid

Wei, Qiuping|0000-0002-3845-9445

pubs.begin-page

1547

pubs.end-page

1554

pubs.issue

2

pubs.organisational-group

School of Medicine

pubs.organisational-group

Duke

pubs.organisational-group

Duke Cancer Institute

pubs.organisational-group

Institutes and Centers

pubs.organisational-group

Population Health Sciences

pubs.organisational-group

Basic Science Departments

pubs.organisational-group

Medicine, Medical Oncology

pubs.organisational-group

Medicine

pubs.organisational-group

Clinical Science Departments

pubs.publication-status

Published

pubs.volume

13

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